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PPGA Package Type
PPGA is short for Plastic Pin Grid Array, and these processors have pins that are inserted into a socket. To improve thermal conductivity, the PPGA uses a nickel plated copper heat slug on top of the processor. The pins on the bottom of the chip are staggered. In addition, the pins are arranged in a way that the processor can only be inserted one way into the socket. The PPGA package is used by early Intel Celeron processors, which have 370 pins.
PGA Package Type
PGA is short for Pin Grid Array, and these processors have pins that are inserted into a socket. To improve thermal conductivity, the PGA uses a nickel plated copper heat slug on top of the processor. The pins on the bottom of the chip are staggered. In addition, the pins are arranged in a way that the processor can only be inserted one way into the socket. The PGA package is used by the Intel Xeon™ processor, which has 603 pins.
S.E.C.C 2 Package Type
The S.E.C.C.2 package is similar to the S.E.C.C. package except the S.E.C.C.2 uses less casing and does not include the thermal plate. The S.E.C.C.2 package was used in some later versions of the Pentium II processor and Pentium III processor (242 contacts).
S.E.P package type
S.E.P. is short for Single Edge Processor. The S.E.P. package is similar to a S.E.C.C. or S.E.C.C.2 package but it has no covering. In addition, the substrate (circuit board) is visible from the bottom side. The S.E.P. package was used by early Intel Celeron processors, which have 242 contacts.
secc package
S.E.C.C. is short for Single Edge Contact Cartridge. To connect to the motherboard, the processor is inserted into a slot. Instead of having pins, it uses goldfinger contacts, which the processor uses to carry its signals back and forth. The S.E.C.C. is covered with a metal shell that covers the top of the entire cartridge assembly. The back of the cartridge is a thermal plate that acts as a heatsink. Inside the S.E.C.C., most processors have a printed circuit board called the substrate that links together the processor, the L2 cache and the bus termination circuits. The S.E.C.C. package was used in the Intel Pentium II processors, which have 242 contacts and the Pentium® II Xeon™ and Pentium III Xeon processors, which have 330 contacts.
NLX motherboard
Definition of: NLX motherboard (New Low-Profile EXtended motherboard) A low-profile PC motherboard from Intel for slimline cases, introduced in 1987. Unlike boards for desktop and tower cases that hold the expansion cards perpendicular to the board, cards plug into a riser card on the NLX and are parallel with the board. See PC motherboards.
LPX MOTHERBOARD
Definition of: LPX motherboard (Low-Profile EXtended motherboard) A low-profile PC motherboard for slimline cases, introduced in 1997 by Western Digital. Unlike boards for desktop and tower cases that hold the expansion cards perpendicular to the board, cards plug into a riser card on the LPX and are parallel with the board. Having a 9" width, the Mini LPX version decreased the length from 13" to 11". See PC motherboards.
AT motherboard
Definition of: Baby AT motherboard A smaller version of the original AT motherboard used in the IBM PC/AT. Introduced in 1987, the Baby AT reduced width from 12" to 8.5". Although its maximum length was 13", most boards were only 9" or 10" long. The Baby AT was the first PC motherboard to build in sockets for I/O ports (serial, parallel, etc.), which were cabled to connectors on the back of the case. Widely used in 386, 486 and early Pentium PCs, the Baby AT was superseded by the ATX motherboard.
ATX motherbord
Definition of: ATX motherboard (Advanced Technology EXtended motherboard) The PC motherboard that superseded the Baby AT design. The ATX layout rotated the CPU and memory 90 degrees, allowing full-length expansions to be plugged into all sockets. The power supply blows air over the CPU rather than pulling air through the chassis.Introduced in 1995, the ATX was the first PC motherboard to not only include I/O support (serial, parallel, mouse, etc.), but to place all the connectors directly on the motherboard. Prior to the ATX, only the keyboard connector was attached to the motherboard.Numerous variations of the ATX were subsequently introduced with both smaller and larger form factors, including the microATX, Mini ATX, FlexATX and Extended ATX (see PC motherboards)
DDR3 memory
today announced their official crossover into DDR3 memory to coincide with the recent launch of the Intel Bearlake Chipset. OCZ’s hand-tested DDR3 solutions enable ardent enthusiasts to take advantage of the highly-anticipated P35 platform while experiencing the legendary quality and reliability of OCZ memory. The first OCZ DDR3 products will accommodate standard JEDEC specifications for third generation DDR. OCZ is pleased pick up where their high-end DDR2 memory left off and offer Gold Series memory kits in PC3-8500 (1066MHz) and PC3-10666 (1333MHz) speed grades. OCZ Gold DDR3 modules will be initially available in 2x512MB and 2x1024MB dual channel kits. These modules are currently available in limited quantity and OCZ has been working closely with the leading platform providers to ensure optimal performance and compatibility on all the next generation computing platforms that will be introduced later this year. Each module is 100% hand-tested for quality assurance and compatibility and feature proprietary gold-mirrored XTC (Xtreme Thermal Convection) heatspreaders for the most effective heat dissipation. As part of OCZ’s line-up of premium memory, the DDR3 series is backed by a Lifetime Warranty and industry-leading technical support for unparalleled peace of mind.
PCI slots
PCI Express x16 slots - CrossFire mode: Each x16 slot operates at x16 bandwidth.- Single VGA mode: Each x16 slot operates at x16 bandwidth.2 PCI Express x1 slots3
AMD Opteron Processor
Dell leads in performance cluster servers with the PowerEdge SC1435 powered by next-generation AMD Opteron Processor. Take advantage of new features like quad-core upgradeability, AMD VirtualizationTM (AMD-VTM ), and energy-efficient DDR-2 memory technologies introduced in these latest AMD Opteron processors. AMD64 technology runs the existing installed base of 32-bit applications and operating systems at peak performance, while providing a 64-bit capable migration path. Plus, AMD's Direct Connect Architecture helps reduce memory and I/O bottlenecks.
NVIDIA nForce4 SLI Intel Processor Edition
the nForce4 SLI Intel Edition will support a 1066MHz front side bus (FSB) and dual channel DDR2. As you would expect, the socket is Intel's latest, the LGA775. Additionally, the board supports NVIDIA's RAID and ActiveArmor firewall. One of the biggest impacts of this announcement and launch is the availability of SLI to Intel users. Now, AMD and Intel fans can enjoy the highest gaming performance available.
K9A2 CF MOTHERBOARD -AMD 790X
Highest cost/performance value CrossFire platform
ABIT AA8 DuraMAX Motherboard (Intel 925X)
The AA8 DuraMAX is based on the newest flagship desktop chipset from Intel, the 925X Express Chipset, and therefore includes the latest motherboard technologies, such as PCI-Express graphics and DDR2. Awesome features, such as Intel's High Definition Audio and SATA Matrix RAID, are also present on this mainboard. Since the AA8 DuraMAX features one of Intel's latest chipsets, it features the new LGA 775 socket, which is also called Socket T. With this socket, the pins are found in the motherboard's socket and not on the processor.